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ADVANCED MATERIALS PREPARATION POLISHING PADS
 Many of the emerging technologies use sapphire, silicon carbide and ceramic wafers to have a very flat surface and high degree of surface finish with low defect densities. The polishing of these materials requires use of different pads and slurries and the modification of the basic variable parameters that are applied to the polishing machine. Spartan Felt Company has a developing line of pads that address the critical needs of these hard materials.
POLISHING PAD DETAILED INFORMATION
All pads are available plain and perforated. Embossing is available, but limited. Please inquire about specific applications.
All pads are available with our own specially developed PSA, magnetic or loop backing to be used with various hook attachments. We currently have 2 types of PSA that cover 2 specific markets. Our standard is for the glass industry is one that resists temps up to 120F, peels easily from the plate and can actually be reapplied. Our second type of PSA is a 3M product that is temperature resistant up to 160F, resistant of pH changes from 5 to 10, but may leave some adhesive on the plate (depending on how it is run and removed).
SPAR-LON-RED PAD | SPS | AMS PAD | PORETEX | PORETEX 2LN
Spartan Polishing Pad Division
 Spartan Spar-Lon-Red Pads
DESCRIPTION: |
Spartan Spar-Lon-Red Polishing Pads |
FOR USE ON: |
This final polishing pad can be used on sapphire, glass, plastics, ceramics, and metals with a variety of abrasive slurries. |
DUROMETER: |
80º Shore A |
COMPRESSION %: |
4% (2 pound Displacement) |
DENSITY: |
.0.40 g/cm3 |
THICKNESS: |
.050” +/- .001” |
DIAMETER: |
Up to 48” Pads |
SURFACE PREPARATION: |
Plain Pads (no perforations or embossing possible) |
BACKINGS: |
PSA or magnetic backings |
IMPREGNATIONS: |
No impregnations; this is a final polish pad. |
CAN REPLACE: |
Eminess Politex products but it is a flocked pad and not poromeric. |
PERFORMANCE: |
This is a soft polishing pad (red, flocked) on a cotton substrate (woven) plus PSA (standard or hydrocarbon resistant). Excellent “super-polished” surfaces can be achieved with the correct alumina, diamond or cerium slurries. |
SPS
DESCRIPTION: |
A unique, cast, microcellular polymeric material specifically designed
and manufactured for superior stock removal, flatness and surface
finish. It is best suited for virgin silicon, delayering & planarization,
compound semiconductor and electro-optic/IR materials and is best
used in combination with the appropriate slurries for those materials.
The proprietary composition of the bulk matrix is a balance of
components and additives that form the correct density and structure
to supplement the nature of the polishing solution being used for the
“applications-specific” surface preparation process. |
FOR USE ON: |
CMP, Virgin silicon wafers & fabricated devises, Cadmium Telluride, Gallium
Arsenide, ZnSe, sapphire, quartz and Stainless Steel |
DUROMETER: |
63 Shore D |
COMPRESSION %: |
0.40 (at 10 PSI) |
DENSITY: |
0.82g/cc3 |
THICKNESS: |
0.050” (1.27mm) |
DIAMETER: |
Up to 30” diameter pads (discs) |
SURFACE PREPARATION: |
Plain (grooved upon request) |
BACKINGS: |
PSA 2 3M High Temp Solvent Resistant. |
IMPREGNATIONS: |
No Impregnations |
CAN REPLACE: |
IC1000 Series |
PERFORMANCE: |
SPS-1 is a very hard and durable pad outside of the non-woven class.
It is a special polymer and not a fiber pad. It is effective under light
pressure or heavy pressure with a variety of slurries and has a
proprietary cellular structure. |
| OPTIONS: |
Available in Plain, Grooved and Preforated |
AMS PAD
DESCRIPTION: |
White fiber based resin treated polyurethane pad for diverse polishing applications and surfaces. The fiber material makes excellent interconnecting cellular structures, which make the pad highly durable and dimensionally stable. This material is designed for rapid stock removal and superb surface finishes. |
FOR USE ON: |
Silicon Wafers, Cadmium Telluride, Gallium Arsenide, Stainless Steel, Sapphire, Silicon Carbide |
DUROMETER: |
Shore C Scale 60 |
COMPRESSION %: |
4-6% (1/2 pound force displacement) |
DENSITY: |
.42 g/cm3 |
THICKNESS: |
.050", .090" and .125" |
DIAMETER: |
Up to 53" in Sheets or Pads |
SURFACE PREPARATION: |
Plain, Perforated or Embossed. |
BACKINGS: |
Easy Apply/Remove PSA Is Standard. High Temperature PSA Magnetic Backing are Available Upon Request |
IMPREGNATIONS: |
Abrasive Impregnates in limited styles. |
CAN REPLACE: |
SUBA X and SUBA 500 |
PERFORMANCE: |
AMS PADis our most popular hard class pad. It is a superbly durable synthetic fiber pad, effective under light pressure. Capillary action fiber structure. Open pore structure, reduced compressibility. |
Poretex Polishing Pad
DESCRIPTION: |
In the surface preparation process, there is a need to produce ultra polished
surfaces with synthetic pads. Spartan Felt Company’s suede polishing material is
designed to generate final polished surfaces using submicron
slurries. It’s
unique, resilient design allows the pore structure to recover from polishing
compression and setsup
a fluid transfer action with the slurry. Poretex Pads are
available in plain, embossed or textured front surfaces. Pressure sensitive
adhesive is standard for use with a wide pH slurry range. |
NAP LENGTH: |
» 50 μ |
WEIGHT: |
598 grams/linear yd. |
COMPRESSION %: |
12% |
DENSITY: |
.35 g/cm3 |
THICKNESS: |
1.2 mm |
DIAMETER: |
Precut
or 53” wide rolls |
HARDNESS: |
68 SHORE A |
PORE SIZE: |
» 400 UM |
Poretex 2LN Polishing Pads
DESCRIPTION: |
In the surface preparation process, there is a need to produce ultra polished surfaces with synthetic pads. Spartan’s suede polishing material is designed to generate final polished surfaces using submicron slurries. It’s “low nap/small pore” composition retains the polishing vehicle on the exposed pad surface allowing for better polished surface quality and lower surface tension to the wafers being polished. While our Poretex 1™ material is best suited for glass, Poretex 2LN™ is excellent for semiconductor and compound semiconductor wafers, quartz, sapphire, silicon carbide and various crystals. These pads are designed to work best with colloidal silica, sodium hydroxide, cerium and alumina slurries over a wide range of pH and slurry concentration mixtures. |
NAP LENGTH: |
» 50 μ |
WEIGHT: |
570 +/50 grams/linear yd. |
COMPRESSION %: |
4.5 +/2.0% |
DENSITY: |
0.42 +/0.05 g/cm3 |
THICKNESS: |
Poretex2-LN is 1.37mm thick (nap 80 micron) |
DIAMETER: |
Precut or 53” wide rolls |
HARDNESS: |
64 +/5 SHORE C |
PORE SIZE: |
60 +/20μ |
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