COMPOUND SEMICONDUCTOR PREPARATION POLISHING PADS

Advanced IC fabrication requirements have brought about the need to polish fragile materials such as gallium arsenide and indium phosphide. Although these materials may be polished as individual wafers, they can also be thin film depositions that need to be polished. Typically, these materials employ more of a chemical polishing process than the traditional chemo-mechanical polishing processes.

POLISHING PAD DETAILED INFORMATION

All pads are available plain and perforated. Embossing is available, but limited. Please inquire about specific applications.

All pads are available with our own specially developed PSA, magnetic or loop backing to be used with various hook attachments. We currently have 2 types of PSA that cover 2 specific markets. Our standard is for the glass industry is one that resists temps up to 120F, peels easily from the plate and can actually be reapplied. Our second type of PSA is a 3M product that is temperature resistant up to 160F, resistant of pH changes from 5 to 10, but may leave some adhesive on the plate (depending on how it is run and removed).

Spartan Polishing Pad Division

Poretex Polishing Pad