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COMPOUND SEMICONDUCTOR PREPARATION POLISHING PADS
 Advanced IC fabrication requirements have brought about the need to polish fragile materials such as gallium arsenide and indium phosphide. Although these materials may be polished as individual wafers, they can also be thin film depositions that need to be polished. Typically, these materials employ more of a chemical polishing process than the traditional chemo-mechanical polishing processes.
POLISHING PAD DETAILED INFORMATION
All pads are available plain and perforated. Embossing is available, but limited. Please inquire about specific applications.
All pads are available with our own specially developed PSA, magnetic or loop backing to be used with various hook attachments. We currently have 2 types of PSA that cover 2 specific markets. Our standard is for the glass industry is one that resists temps up to 120F, peels easily from the plate and can actually be reapplied. Our second type of PSA is a 3M product that is temperature resistant up to 160F, resistant of pH changes from 5 to 10, but may leave some adhesive on the plate (depending on how it is run and removed).
SPS | PORETEX | PORETEX 2LN
Spartan Polishing Pad Division
 SPS
DESCRIPTION: |
A unique, cast, microcellular polymeric material specifically designed
and manufactured for superior stock removal, flatness and surface
finish. It is best suited for virgin silicon, delayering & planarization,
compound semiconductor and electro-optic/IR materials and is best
used in combination with the appropriate slurries for those materials.
The proprietary composition of the bulk matrix is a balance of
components and additives that form the correct density and structure
to supplement the nature of the polishing solution being used for the
“applications-specific” surface preparation process. |
FOR USE ON: |
CMP, Virgin silicon wafers & fabricated devises, Cadmium Telluride, Gallium
Arsenide, ZnSe, sapphire, quartz and Stainless Steel |
DUROMETER: |
63 Shore D |
COMPRESSION %: |
0.40 (at 10 PSI) |
DENSITY: |
0.82g/cc3 |
THICKNESS: |
0.050” (1.27mm) |
DIAMETER: |
Up to 30” diameter pads (discs) |
SURFACE PREPARATION: |
Plain (grooved upon request) |
BACKINGS: |
PSA 2 3M High Temp Solvent Resistant. |
IMPREGNATIONS: |
No Impregnations |
CAN REPLACE: |
IC1000 Series |
PERFORMANCE: |
SPS-1 is a very hard and durable pad outside of the non-woven class.
It is a special polymer and not a fiber pad. It is effective under light
pressure or heavy pressure with a variety of slurries and has a
proprietary cellular structure. |
| OPTIONS: |
Available in Plain, Grooved and Preforated |
Poretex Polishing Pad
DESCRIPTION: |
In the surface preparation process, there is a need to produce ultra polished
surfaces with synthetic pads. Spartan Felt Company’s suede polishing material is
designed to generate final polished surfaces using submicron
slurries. It’s
unique, resilient design allows the pore structure to recover from polishing
compression and setsup
a fluid transfer action with the slurry. Poretex Pads are
available in plain, embossed or textured front surfaces. Pressure sensitive
adhesive is standard for use with a wide pH slurry range. |
NAP LENGTH: |
» 50 μ |
WEIGHT: |
598 grams/linear yd. |
COMPRESSION %: |
12% |
DENSITY: |
.35 g/cm3 |
THICKNESS: |
1.2 mm |
DIAMETER: |
Precut
or 53” wide rolls |
HARDNESS: |
68 SHORE A |
PORE SIZE: |
» 400 UM |
Poretex 2LN Polishing Pads
DESCRIPTION: |
In the surface preparation process, there is a need to produce ultra polished surfaces with synthetic pads. Spartan’s suede polishing material is designed to generate final polished surfaces using submicron slurries. It’s “low nap/small pore” composition retains the polishing vehicle on the exposed pad surface allowing for better polished surface quality and lower surface tension to the wafers being polished. While our Poretex 1™ material is best suited for glass, Poretex 2LN™ is excellent for semiconductor and compound semiconductor wafers, quartz, sapphire, silicon carbide and various crystals. These pads are designed to work best with colloidal silica, sodium hydroxide, cerium and alumina slurries over a wide range of pH and slurry concentration mixtures. |
NAP LENGTH: |
» 50 μ |
WEIGHT: |
570 +/50 grams/linear yd. |
COMPRESSION %: |
4.5 +/2.0% |
DENSITY: |
0.42 +/0.05 g/cm3 |
THICKNESS: |
450 +/80μ mm |
DIAMETER: |
Precut or 53” wide rolls |
HARDNESS: |
64 +/5 SHORE C |
PORE SIZE: |
60 +/20μ |
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