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 SEMICONDUCTOR PREPARATION POLISHING PADS
The backbone of the semiconductor industry is the integrated circuit. IC’s use silicon and germanium wafers as the basis for the original microchip. Such microchips have become smaller in scale over the years and therefore the quality and consistency if the polishing pads used to prepare the active surfaces also need to improve. In the manufacturing of Spartan Polishing Pads, quality control is essential in providing a consistent product. Pad types range from medium-hard densities to soft textures in order to meet the total surface preparation spectrum. Traditional virgin material polishing as well as planarization applications can be accomplished using Spartan Polishing Pads.
POLISHING PAD DETAILED INFORMATION
All pads are available plain and perforated. Embossing is available, but limited. Please inquire about specific applications.
All pads are available with our own specially developed PSA, magnetic or loop backing to be used with various hook attachments. We currently have 2 types of PSA that cover 2 specific markets. Our standard is for the glass industry is one that resists temps up to 120F, peels easily from the plate and can actually be reapplied. Our second type of PSA is a 3M product that is temperature resistant up to 160F, resistant of pH changes from 5 to 10, but may leave some adhesive on the plate (depending on how it is run and removed).
HPB75 | HPC75 | HPB35 | PORETEX
Spartan Polishing Pad Division
HPB75 POLISHING
MATERIAL
DESCRIPTION: |
White fiber based resin treated polyurethane pad for diverse polishing applications and surfaces. The fiber material makes excellent interconnecting cellular structures, which make the pad highly durable and dimensionally stable. This material is designed for rapid stock removal and superb surface finishes. |
FOR USE ON: |
Hand Held Machines/Low to medium pressure applications |
DUROMETER: |
Shore C Scale 40 |
COMPRESSION %: |
2-4% (4 pound force displacement) |
DENSITY: |
.37 g/cm3 |
THICKNESS: |
.090” and .150” |
DIAMETER: |
Up to 53” Sheets or Pads |
SURFACE PREPARATION: |
Plain, Perforated or Embossed. |
BACKINGS: |
Easy Apply/Remove PSA is Standard. High Temperature PSA and Magnetic Backing are Available. |
IMPREGNATIONS: |
Abrasive Impregnates in limited styles. |
CAN REPLACE: |
SUBA X or PELLON |
PERFORMANCE: |
HPB75 offers equal polishing as our HPB60 pad for customers who want a slightly higher density and durometer. |
HPC75 POLISHING MATERIAL
DESCRIPTION: |
White or color fiber based resin treated polyurethane pad for diverse
polishing applications and surfaces. The fiber material makes excellent
interconnecting cellular structures, which make the pad highly durable
and dimensionally stable. This material is designed for rapid stock
removal and superb surface finishes. |
FOR USE ON: |
Crystal and Medium Hardness Glass, Quartz, Stainless Steel |
DUROMETER: |
Shore C Scale 50 |
COMPRESSION %: |
3-5% (1/2 pound force displacement) |
DENSITY: |
.33 g/cm3 |
THICKNESS: |
.050” |
DIAMETER: |
Up to 53” Sheets or Pads |
SURFACE PREPARATION: |
Plain, Perforated or Embossed. |
BACKINGS: |
Easy Apply/Remove PSA is Standard. High Temperature PSA and
Magnetic Backing are Available Upon Request. |
IMPREGNATIONS: |
Abrasive Impregnates in limited styles. |
CAN REPLACE: |
SUBA X or PELLON |
PERFORMANCE: |
HPC75 is the softest of our HPC hard class pads. This material is often
used on automated machines with non-critical flatness, but high finish
requirements. |
HPB35 POLISHING MATERIAL
DESCRIPTION: |
White fiber based resin treated polyurethane pad for diverse polishing applications and surfaces. The fiber material makes excellent interconnecting cellular structures, which make the pad highly durable and dimensionally stable. This material is designed for rapid stock removal and superb surface finishes. |
FOR USE ON: |
Art Glass, Soft Scientific Glass and Polycarbonate |
DUROMETER: |
Shore C Scale 35 |
COMPRESSION %: |
5-7% (4 pound force displacement) |
DENSITY: |
.35 g/cm3 |
THICKNESS: |
.125” and .275” |
DIAMETER: |
Up to 53” Sheets or Pads |
SURFACE PREPARATION: |
Plain, Perforated or Embossed. |
BACKINGS: |
Easy Apply/Remove PSA is Standard. High Temperature PSA and Magnetic Backing are Available Upon Request. |
IMPREGNATIONS: |
Abrasive Impregnates in limited styles. |
CAN REPLACE: |
Natural Wool and Other Soft Synthetic Felts |
PERFORMANCE: |
HPB35 is our softest and most forgiving pad. Designed for hand polishing, HPB35 retains a high amount of water for efficient slurry delivery with various sized parts and under a wide variety of pressures and polishing styles. |
Poretex Polishing Pad
DESCRIPTION: |
In the surface preparation process, there is a need to produce ultra polished
surfaces with synthetic pads. Spartan Felt Company’s suede polishing material is
designed to generate final polished surfaces using submicron
slurries. It’s
unique, resilient design allows the pore structure to recover from polishing
compression and setsup
a fluid transfer action with the slurry. Poretex Pads are
available in plain, embossed or textured front surfaces. Pressure sensitive
adhesive is standard for use with a wide pH slurry range. |
NAP LENGTH: |
» 50 μ |
WEIGHT: |
598 grams/linear yd. |
COMPRESSION %: |
12% |
DENSITY: |
.35 g/cm3 |
THICKNESS: |
1.2 mm |
DIAMETER: |
Precut
or 53” wide rolls |
HARDNESS: |
68 SHORE A |
PORE SIZE: |
» 400 UM |
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