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SEMICONDUCTOR PREPARATION POLISHING PADS
 The backbone of the semiconductor industry is the integrated circuit. IC’s use silicon and germanium wafers as the basis for the original microchip. Such microchips have become smaller in scale over the years and therefore the quality and consistency if the polishing pads used to prepare the active surfaces also need to improve. In the manufacturing of Spartan Polishing Pads, quality control is essential in providing a consistent product. Pad types range from medium-hard densities to soft textures in order to meet the total surface preparation spectrum. Traditional virgin material polishing as well as planarization applications can be accomplished using Spartan Polishing Pads.
POLISHING PAD DETAILED INFORMATION
All pads are available plain and perforated. Embossing is available, but limited. Please inquire about specific applications.
All pads are available with our own specially developed PSA, magnetic or loop backing to be used with various hook attachments. We currently have 2 types of PSA that cover 2 specific markets. Our standard is for the glass industry is one that resists temps up to 120F, peels easily from the plate and can actually be reapplied. Our second type of PSA is a 3M product that is temperature resistant up to 160F, resistant of pH changes from 5 to 10, but may leave some adhesive on the plate (depending on how it is run and removed).
SPS | HPB75 | HPC75 | HPB35 | PORETEX | PORETEX 2LN | HPC5080
HPC4560 | HPB6040 | Spartan Gray High Tech G/B Pad
Spartan Polishing Pad Division
 SPS
DESCRIPTION: |
A unique, cast, microcellular polymeric material specifically designed
and manufactured for superior stock removal, flatness and surface
finish. It is best suited for virgin silicon, delayering & planarization,
compound semiconductor and electro-optic/IR materials and is best
used in combination with the appropriate slurries for those materials.
The proprietary composition of the bulk matrix is a balance of
components and additives that form the correct density and structure
to supplement the nature of the polishing solution being used for the
“applications-specific” surface preparation process. |
FOR USE ON: |
CMP, Virgin silicon wafers & fabricated devises, Cadmium Telluride, Gallium
Arsenide, ZnSe, sapphire, quartz and Stainless Steel |
DUROMETER: |
63 Shore D |
COMPRESSION %: |
0.40 (at 10 PSI) |
DENSITY: |
0.82g/cc3 |
THICKNESS: |
0.050” (1.27mm) |
DIAMETER: |
Up to 30” diameter pads (discs) |
SURFACE PREPARATION: |
Plain, Grooved and Preforated |
BACKINGS: |
PSA 2 3M High Temp Solvent Resistant. |
IMPREGNATIONS: |
No Impregnations |
CAN REPLACE: |
IC1000 Series |
PERFORMANCE: |
SPS-1 is a very hard and durable pad outside of the non-woven class.
It is a special polymer and not a fiber pad. It is effective under light
pressure or heavy pressure with a variety of slurries and has a
proprietary cellular structure. |
HPB75 POLISHING MATERIAL
DESCRIPTION: |
White fiber based resin treated polyurethane pad for diverse polishing applications and surfaces. The fiber material makes excellent interconnecting cellular structures, which make the pad highly durable and dimensionally stable. This material is designed for rapid stock removal and superb surface finishes. |
FOR USE ON: |
Hand Held Machines/Low to medium pressure applications |
DUROMETER: |
Shore C Scale 40 |
COMPRESSION %: |
2-4% (4 pound force displacement) |
DENSITY: |
.37 g/cm3 |
THICKNESS: |
.090” and .150” |
DIAMETER: |
Up to 53” Sheets or Pads |
SURFACE PREPARATION: |
Plain, Perforated or Embossed. |
BACKINGS: |
Easy Apply/Remove PSA is Standard. High Temperature PSA and Magnetic Backing are Available. |
IMPREGNATIONS: |
Abrasive Impregnates in limited styles. |
CAN REPLACE: |
SUBA X or PELLON |
PERFORMANCE: |
HPB75 offers equal polishing as our HPB60 pad for customers who want a slightly higher density and durometer. |
HPC75 POLISHING MATERIAL
DESCRIPTION: |
White or color fiber based resin treated polyurethane pad for diverse
polishing applications and surfaces. The fiber material makes excellent
interconnecting cellular structures, which make the pad highly durable
and dimensionally stable. This material is designed for rapid stock
removal and superb surface finishes. |
FOR USE ON: |
Crystal and Medium Hardness Glass, Quartz, Stainless Steel |
DUROMETER: |
Shore C Scale 50 |
COMPRESSION %: |
3-5% (1/2 pound force displacement) |
DENSITY: |
.33 g/cm3 |
THICKNESS: |
.050” |
DIAMETER: |
Up to 53” Sheets or Pads |
SURFACE PREPARATION: |
Plain, Perforated or Embossed. |
BACKINGS: |
Easy Apply/Remove PSA is Standard. High Temperature PSA and
Magnetic Backing are Available Upon Request. |
IMPREGNATIONS: |
Abrasive Impregnates in limited styles. |
CAN REPLACE: |
SUBA X or PELLON |
PERFORMANCE: |
HPC75 is the softest of our HPC hard class pads. This material is often
used on automated machines with non-critical flatness, but high finish
requirements. |
HPB35 POLISHING MATERIAL
DESCRIPTION: |
White fiber based resin treated polyurethane pad for diverse polishing applications and surfaces. The fiber material makes excellent interconnecting cellular structures, which make the pad highly durable and dimensionally stable. This material is designed for rapid stock removal and superb surface finishes. |
FOR USE ON: |
Art Glass, Soft Scientific Glass and Polycarbonate |
DUROMETER: |
Shore C Scale 35 |
COMPRESSION %: |
5-7% (4 pound force displacement) |
DENSITY: |
.35 g/cm3 |
THICKNESS: |
.125” and .275” |
DIAMETER: |
Up to 53” Sheets or Pads |
SURFACE PREPARATION: |
Plain, Perforated or Embossed. |
BACKINGS: |
Easy Apply/Remove PSA is Standard. High Temperature PSA and Magnetic Backing are Available Upon Request. |
IMPREGNATIONS: |
Abrasive Impregnates in limited styles. |
CAN REPLACE: |
Natural Wool and Other Soft Synthetic Felts |
PERFORMANCE: |
HPB35 is our softest and most forgiving pad. Designed for hand polishing, HPB35 retains a high amount of water for efficient slurry delivery with various sized parts and under a wide variety of pressures and polishing styles. |
Poretex Polishing Pad
DESCRIPTION: |
In the surface preparation process, there is a need to produce ultra polished
surfaces with synthetic pads. Spartan Felt Company’s suede polishing material is
designed to generate final polished surfaces using submicron
slurries. It’s
unique, resilient design allows the pore structure to recover from polishing
compression and setsup
a fluid transfer action with the slurry. Poretex Pads are
available in plain, embossed or textured front surfaces. Pressure sensitive
adhesive is standard for use with a wide pH slurry range. |
NAP LENGTH: |
» 50 μ |
WEIGHT: |
598 grams/linear yd. |
COMPRESSION %: |
12% |
DENSITY: |
.35 g/cm3 |
THICKNESS: |
1.2 mm |
DIAMETER: |
Precut
or 53” wide rolls |
HARDNESS: |
68 SHORE A |
PORE SIZE: |
» 400 UM |
Poretex 2LN Polishing Pads
DESCRIPTION: |
In the surface preparation process, there is a need to produce ultra polished
surfaces with synthetic pads. Spartan’s suede polishing material is designed to
generate final polished surfaces using submicron
slurries. It’s “low nap/small
pore” composition retains the polishing vehicle on the exposed pad surface
allowing for better polished surface quality and lower surface tension to the
wafers being polished. While our Poretex 1™ material is best suited for glass,
Poretex 2LN™ is excellent for semiconductor and compound semiconductor
wafers, quartz, sapphire, silicon carbide and various crystals. These pads are
designed to work best with colloidal silica, sodium hydroxide, cerium and alumina
slurries over a wide range of pH and slurry concentration mixtures. |
NAP LENGTH: |
» 50 μ |
WEIGHT: |
570 +/50 grams/linear yd. |
COMPRESSION %: |
4.5 +/2.0% |
DENSITY: |
0.42 +/0.05 g/cm3 |
THICKNESS: |
Poretex2-LN is 1.37mm thick (nap 80 micron) |
DIAMETER: |
Precut or 53” wide rolls |
HARDNESS: |
64 +/5 SHORE C |
PORE SIZE: |
60 +/20μ |
HPC5080 POLISHING MATERIAL
DESCRIPTION: |
Yellow color, fiber based resin treated polyurethane pad for diverse polishing applications and surfaces. The fiber material makes excellent interconnecting cellular structures, which make the pad highly durable and dimensionally stable. This pad is designed for super fine surface finishes. |
FOR USE ON: |
Hard Glass and Crystal |
DUROMETER: |
Shore C Scale 85 |
COMPRESSION %: |
1-3% (1/2 pound force displacement) |
DENSITY: |
.85 g/cm3 |
THICKNESS: |
.045” |
DIAMETER: |
Up to 36” in Sheets or Pads |
SURFACE PREPARATION: |
Plain, Preforated or Embossed. Plain and Preforated available for sheets up to 36” |
BACKINGS: |
Easy Apply/Remove PSA Is Standard. High Temperature PSA Magnetic Backing are Available Upon Request |
IMPREGNATIONS: |
Abrasive Impregnation Available Upon Request |
CAN REPLACE: |
SUBA 500, IC |
PERFORMANCE: |
HPB75 offers equal polishing as our HPB60 pad for customers who want a slightly higher density and durometer. |
HPC4560 POLISHING MATERIAL
DESCRIPTION: |
White or color fiber based resin treated polyurethane pad for diverse polishing applications and surfaces. The fiber material makes excellent interconnecting cellular structures, which make the pad highly durable and dimensionally stable. This material is designed for rapid stock removal and superb surface finishes. HPC-4560 is less absorbent than HPC4545. |
FOR USE ON: |
Glass, Ceramic, Fused Silica, and Sapphire |
DUROMETER: |
Shore C Scale 60 |
COMPRESSION %: |
3-5% (1/2 pound force displacement) |
DENSITY: |
.46 g/cm3 |
THICKNESS: |
.050” and .150” |
DIAMETER: |
Up to 53” in Sheets or Pads |
SURFACE PREPARATION: |
Plain, Preforated or Embossed. Plain available for sheets up to 53" and Preforated available for sheets up to 38” |
BACKINGS: |
Easy Apply/Remove PSA Is Standard. High Temperature PSA Magnetic Backing are Available. |
IMPREGNATIONS: |
Abrasive Impregnates in limited styles. |
CAN REPLACE: |
SUBA X and SUBA 500 |
PERFORMANCE: |
HPC-4560 is an enhanced version of our most popular hard class pad HPC4545. It is a superbly durable synthetic fiber pad, effective under light pressure. Capillary action fiber structure. Open pore structure, reduced compressibility. |
HPB6040 POLISHING MATERIAL
DESCRIPTION: |
White fiber based resin treated polyurethane pad for diverse polishing applications and surfaces. The fiber material makes excellent interconnecting cellular structures, which make the pad highly durable and dimensionally stable. This material is designed for rapid stock removal and superb surface finishes. HPB6040 is less absorbent than HPB60. |
FOR USE ON: |
Great for hand held machines and for use on low to medium pressure applications for fragile and delicate items. |
DUROMETER: |
Shore C Scale 40 |
COMPRESSION %: |
4-6% (4 pound force displacement) |
DENSITY: |
.39 g/cm3 |
THICKNESS: |
.125” and .180” |
DIAMETER: |
Up to 53 Sheets and Pads |
SURFACE PREPARATION: |
Plain, Preforated or Embossed. Plain available for sheets up to 53" and Preforated available for sheets up to 38” |
BACKINGS: |
Easy Apply/Remove PSA is Standard. High Temperature PSA and Magnetic Backing are Available Upon Request. |
IMPREGNATIONS: |
Abrasive Impregnates in limited styles. |
CAN REPLACE: |
SUBA IV, GS-BB |
PERFORMANCE: |
HPB-6040 is an enhanced version of our most popular soft pad HPB60. It offers customers quicker more efficient turn over of spent slurry. HPB-6040 performs like dense natural wool with superb delivery of abrasives this pad reduces some of the pressure restrictions of HPB60 while still allowing decrease slurry usage. |
Spartan Gray High Tech G/B Pad
| DESCRIPTION: |
This material is a polymer, porous, cubic-structure, nonwoven, synthetic leather material. It has excellent surface wear resistance, high liquid absorbing ability and good resistance to shear mechanical stresses. It has a textured gray appearance with micro voids for improved slurry distribution. It is available in plain, embossed or perforated textured surfaces upon request. It can be compared to Diamex Alpha 125 or Eminess Suba pads. |
| FOR USE ON: |
Hard Glass, Crystal, Ceramic Seals and Sapphire |
| DUROMETER: |
56+/- 5 (Asker C) |
| COMPRESSION %: |
9% +/-5%; 80% +/- 20% Recovery |
| THICKNESS: |
1.30mm +/- 0.05 (~.050”) |
| DIAMETER: |
Up to 53” pads |
| IMPREGNATIONS: |
Non-impregnated; designed to be used with colloidal silica, cerium oxide, alumina, etc. |
| Chemical Resistance |
Acid: pH 1-7
Caustic: pH 7-13 |
| Heat Resistance of Pad Material |
190˚C (~374˚F) for pad bulk matrix; application requirements depend on specific PSA rating. |
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