Compound Semiconductor Polishing Pads

New, More Durable, Premium Stock Removal Polishing Pad – EL1-KS POLISHING MATERIAL

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FOR USE ON: Most Semiconductor, Compound Semi, Optic/Electro-Optic & Sapphire Applications
DUROMETER (Scale C): 58
COMPRESSION %: 2% (1/2 lb. force displacement)
DENSITY: .53 g/cm3 (25 lb.)
THICKNESS: 0.050”
DIAMETER: Up To 60” Sheets or Pads…

More Info and Spec Sheet…

Spartan OMNI-White Polishing Pad

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FOR USE ON: Optical, electro-optical, metals, semiconductor, compound semiconductor and ceramic materials as a gentle stock removal
pad or a final polishing pad.
HARDNESS (Scale C): 55 – 60
COMPRESSION %: 11-13%
DENSITY: 0.383-0.468 g/cm3
THICKNESS: 0.050”, 0.090”, 0.125”
DIAMETER:

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Sparlon 2

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FOR USE ON: This final polishing pad can be used on sapphire, glass, plastics, ceramics, and metals with a variety of abrasive slurries.
DUROMETER: 80º Shore A
COMPRESSION %: 4% (2 pound Displacement)
DENSITY: .0.40 g/cm3
THICKNESS: .050” +/- .001”…

More Info and Spec Sheet…

HPC5080 Polishing Pad

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FOR USE ON: Hard Glass and Crystal
DUROMETER: Shore C Scale 85
COMPRESSION %: 1-3% (1/2 pound force displacement)
DENSITY: .85 g/cm3
THICKNESS: .045”
DIAMETER: Up to 60” in Sheets or Pads…

More Info and Spec Sheet…