Glass Polishing Pads

Sparlon 2

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FOR USE ON: This final polishing pad can be used on sapphire, glass, plastics, ceramics, and metals with a variety of abrasive slurries.
DUROMETER: 80º Shore A
COMPRESSION %: 4% (2 pound Displacement)
DENSITY: .0.40 g/cm3
THICKNESS: .050” +/- .001”…

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Spartan Omni-Gray Polishing Pad

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FOR USE ON: Silicon, Sapphire and Silicon Carbide for the 1st step polishing application
SURFACE OPTIONS: Plain, grooved, or embossed (up to 36”)
COMPRESSION %: 10%
DENSITY: 0.300 g/cm³
THICKNESS: 0.050”, 0.090”, 0.125”
DIAMETER: up to 55.5”…

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AMS Polishing Pad

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FOR USE ON: Silicon Wafers, Cadmium Telluride, Gallium Arsenide, Stainless Steel, Sapphire, Silicon Carbide
DUROMETER: Shore C Scale 60
COMPRESSION %: 4-6% (1/2 pound force displacement)
DENSITY: .42 g/cm3
THICKNESS: .050″, .090″ and .125″
DIAMETER: Up to 53″ in Sheets …

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Poretex 2LN Polishing Pads

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FOR USE ON: Used to produce ultra polished surfaces with synthetic pads
NAP LENGTH: » 50 μ
WEIGHT: 570 +/50 grams/linear yd.
COMPRESSION %: 4.5 +/2.0%
DENSITY: 0.42 +/0.05 g/cm3
THICKNESS: 450 +/80μ mm
DIAMETER: Precut or 53” wide rolls…

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Spartan Durotex

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FOR USE ON: designed and manufactured to polish a wide variety of materials in a single-step type process including optics, electro-optics, semiconductor, aluminum discs, LCD/plasma display and ceramic compositions
THICKNESS: 0.5 – 2.5mm
DENSITY: 0.67 g/cm3
WIDTH: 400 x 700mm …

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HPC75 Polishing Pad

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FOR USE ON: Crystal and Medium Hardness Glass, Quartz, Stainless Steel
DUROMETER: Shore C Scale 50
COMPRESSION %: 3-5% (1/2 pound force displacement)
DENSITY: .33 g/cm3
THICKNESS: .050”
DIAMETER: Up to 53” Sheets or Pads…

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HPC5080 Polishing Pad

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FOR USE ON: Hard Glass and Crystal
DUROMETER: Shore C Scale 85
COMPRESSION %: 1-3% (1/2 pound force displacement)
DENSITY: .85 g/cm3
THICKNESS: .045”
DIAMETER: Up to 36” in Sheets or Pads…

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HPB6040 Polishing Pad

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FOR USE ON: Great for hand held machines and for use on low to medium pressure applications for fragile and delicate items.
DUROMETER: Shore C Scale 40
COMPRESSION %: 4-6% (4 pound force displacement)
DENSITY: .39 g/cm3
THICKNESS: .125” and …

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HPC4545 Polishing Pad

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FOR USE ON: Silicon Wafers, Cadmium Telluride, Gallium Arsenide, Stainless Steel
DUROMETER: Shore C Scale 55
COMPRESSION%: 3-5% (1/2 pound force displacement)
DENSITY: .46 g/cm3
THICKNESS: .050” and .150”
DIAMETER: Up to 53” in Sheets or Pads…

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HPB35 POLISHING MATERIAL

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FOR USE ON: Art Glass Polishing, Soft Scientific Glass Polishing and Polycarbonate Polishing
DUROMETER: Shore C Scale 35
COMPRESSION %: 5-7% (4 pound force displacement)
DENSITY: .35 g/cm3
THICKNESS: .125” and .275”
DIAMETER: Up to 53” Sheets or Pads…

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