Semiconductor Polishing Pads

New, More Durable, Premium Stock Removal Polishing Pad – EL1-KS POLISHING MATERIAL

Thumbnail image for New, More Durable, Premium Stock Removal Polishing Pad – EL1-KS POLISHING MATERIAL

FOR USE ON: Most Semiconductor, Compound Semi, Optic/Electro-Optic & Sapphire Applications
DUROMETER (Scale C): 58
COMPRESSION %: 2% (1/2 lb. force displacement)
DENSITY: .53 g/cm3 (25 lb.)
THICKNESS: 0.050”
DIAMETER: Up To 60” Sheets or Pads…

More Info and Spec Sheet…

Spartan Warrior Pad

Thumbnail image for Spartan Warrior Pad

FOR USE ON: The Spartan Warrior Pad is a versatile pad and can be used for most polishing applications by adjusting the polishing process variable
parameter.
HARDNESS (Scale C): 42
COMPRESSION %: 5%
DENSITY: 0.326 g/cm3
THICKNESS: 0.050”-0.220”
DIAMETER: Plain …

More Info and Spec Sheet…

Spartan OMNI-White Polishing Pad

Thumbnail image for Spartan OMNI-White Polishing Pad

FOR USE ON: Optical, electro-optical, metals, semiconductor, compound semiconductor and ceramic materials as a gentle stock removal
pad or a final polishing pad.
HARDNESS (Scale C): 55 – 60
COMPRESSION %: 11-13%
DENSITY: 0.383-0.468 g/cm3
THICKNESS: 0.050”, 0.090”, 0.125”
DIAMETER:

More Info and Spec Sheet…

Sparlon 2

Thumbnail image for Sparlon 2

FOR USE ON: This final polishing pad can be used on sapphire, glass, plastics, ceramics, and metals with a variety of abrasive slurries.
DUROMETER: 80º Shore A
COMPRESSION %: 4% (2 pound Displacement)
DENSITY: .0.40 g/cm3
THICKNESS: .050” +/- .001”…

More Info and Spec Sheet…

Spartan Omni-Gray Polishing Pad

Thumbnail image for Spartan Omni-Gray Polishing Pad

FOR USE ON: Silicon, Sapphire and Silicon Carbide for the 1st step polishing application
SURFACE OPTIONS: Plain, grooved, or embossed (up to 36”)
COMPRESSION %: 10%
DENSITY: 0.300 g/cm³
THICKNESS: 0.050”, 0.090”, 0.125”
DIAMETER: up to 60”…

More Info and Spec Sheet…

AMS Polishing Pad

Thumbnail image for AMS Polishing Pad

FOR USE ON: Silicon Wafers, Cadmium Telluride, Gallium Arsenide, Stainless Steel, Sapphire, Silicon Carbide
DUROMETER: Shore C Scale 60
COMPRESSION %: 4-6% (1/2 pound force displacement)
DENSITY: .42 g/cm3
THICKNESS: .050″, .090″ and .125″
DIAMETER: Up to 60″ in Sheets …

More Info and Spec Sheet…

Poretex 2LN Polishing Pads

Thumbnail image for Poretex 2LN Polishing Pads

FOR USE ON: Used to produce ultra polished surfaces with synthetic pads
NAP LENGTH: » 50 μ
WEIGHT: 570 +/50 grams/linear yd.
COMPRESSION %: 4.5 +/2.0%
DENSITY: 0.42 +/0.05 g/cm3
THICKNESS: 450 +/80μ mm
DIAMETER: Precut or 53” wide rolls…

More Info and Spec Sheet…

Spartan Durotex

Thumbnail image for Spartan Durotex

FOR USE ON: designed and manufactured to polish a wide variety of materials in a single-step type process including optics, electro-optics, semiconductor, aluminum discs, LCD/plasma display and ceramic compositions
THICKNESS: 0.5 – 2.5mm
DENSITY: 0.67 g/cm3
WIDTH: 400 x 700mm …

More Info and Spec Sheet…

HPC75 Polishing Pad

Thumbnail image for HPC75 Polishing Pad

FOR USE ON: Crystal and Medium Hardness Glass, Quartz, Stainless Steel
DUROMETER: Shore C Scale 50
COMPRESSION %: 3-5% (1/2 pound force displacement)
DENSITY: .33 g/cm3
THICKNESS: .050”
DIAMETER: Up to 60” Sheets or Pads…

More Info and Spec Sheet…

HPC5080 Polishing Pad

Thumbnail image for HPC5080 Polishing Pad

FOR USE ON: Hard Glass and Crystal
DUROMETER: Shore C Scale 85
COMPRESSION %: 1-3% (1/2 pound force displacement)
DENSITY: .85 g/cm3
THICKNESS: .045”
DIAMETER: Up to 60” in Sheets or Pads…

More Info and Spec Sheet…