New, More Durable, Premium Stock Removal Polishing Pad – EL1-KS POLISHING MATERIAL

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FOR USE ON: Most Semiconductor, Compound Semi, Optic/Electro-Optic & Sapphire Applications
DUROMETER (Scale C): 58
COMPRESSION %: 2% (1/2 lb. force displacement)
DENSITY: .53 g/cm3 (25 lb.)
THICKNESS: 0.050”
DIAMETER: Up To 60” Sheets or Pads

 

DESCRIPTION:
Durable Premium Polishing Pad. These are very durable stock removal pads with extended life that provide excellent stock removal, flatness and surface quality on semiconductor, optic/electro-optic and advanced hard materials such as sapphire and silicon carbide.
PERFORMANCE:
Performs well with colloidal silica, cerium oxide, alumina and diamond compound slurries. Can be used as a single step pad with the proper slurry formulations and machine parameter settings on many materials.
BACKING:
Easy Apply/Remove PSA Is Standard. High Temperature PSA and Magnetic Backing Are Available Upon Request
CAN REPLACE:
Suba Series Pads